Dow showcased silicone materials at Semicon Taiwan 2026

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Dow showcased silicone materials at Semicon Taiwan 2026

September 7, 2026

RubberWorld

Taipei, Taiwan – Dow showcased silicone materials and co-development capabilities designed to help semiconductor manufacturers address the thermal, mechanical and integration challenges intensifying as artificial intelligence, high-performance computing and data center applications drive demand for advanced packaging during SEMICON Taiwan 2026.

As power density and heterogeneous integration increase, package performance depends on more than a single material property. Interfacial thermal resistance, bond-line control, stress management, materials compatibility, optical stability and long-term reliability must be considered together — and earlier in package design and qualification.

“The next generation of semiconductor performance will be shaped not only by chip architecture, but also by how materials, package structures and system’s process work together,” said Cathy Chu, global strategic marketing director for Consumer & Electronics, Dow Consumer Solutions. “Dow is bringing materials science into design and validation earlier. Through DOW™ Cooling Science and our Cooling Science Studios in Shanghai and Auburn, Michigan, we can work with customers to define critical-to-quality requirements, screen materials, test applications and build stronger technical evidence before high-volume manufacturing.”

Dow’s Cooling Science approach is designed to move collaboration beyond material selection. By evaluating material, package structure and system’s process conditions in one development framework, Dow aims to help engineering teams identify potential risks earlier, improve development efficiency and accelerate qualification for next-generation semiconductor applications.

TIM 1 for advanced computing and mobility. Silicone thermal interface materials are designed to deliver high thermal conductivity, low bond line thickness, and stable coverage to efficiently transfer heat from the die to the lid. These attributes can help deliver reliable heat dissipation from within the package and withstand package stress and warpage during thermal cycling.

MEMS and sensor packaging. Silicone materials formulated without intentionally added PFAS are designed to meet requirements for materials compliance and sustainable objectives with robust device protection and long-term reliability for highly sensitive MEMS and sensor modules.

High-speed optical interconnects. Silicone optical materials for optical modules, fiber array units can enable ultra-fast signal transmission, low loss of power, and high reliability by offering excellent dielectric performance, thermal stability, and mechanical compliance.

Wafer-level and panel-level packaging. Silicone hot-melt technology is designed to support lamination and molding processes, warpage control, stress dissipation, bonding strength and large modulus applications.

Dow’s Cooling Science Studios in Shanghai and Auburn integra

*Source: Rubber World. For reference only.